MC34845CEPR2 footprint, schematic symbol and 3D model by NXP

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PCB Footprints

MC34845CEPR2 - NXP PCB footprint - Other - Other - QFN50P400X400X65-25N

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Part Number MC34845CEPR2
Manufacturer NXP
Pin Count 25
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - QFN50P400X400X65-25N
Released Date Jan 11, 2017
Last Modified Date Nov 15, 2024 1:35 PM UTC
Pinout / Pin List Click Here (Member Only)

MC34845CEPR2 Details

Manufacturer Part Number:
MC34845CEPR2
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
QFN-24
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Manufacturer:
NXP Semiconductors
YTEOL:
0
Data Input Mode:
SERIAL
Input Characteristics:
STANDARD
Interface IC Type:
LED DISPLAY DRIVER
JESD-30 Code:
S-XQCC-N24
Length:
4 mm
Moisture Sensitivity Level:
3
Multiplexed Display Capability:
NO
Number of Functions:
1
Number of Segments:
96
Number of Terminals:
24
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Output Polarity:
TRUE
Package Body Material:
UNSPECIFIED
Package Code:
HVQCCN
Package Equivalence Code:
LCC24,.16SQ,20
Package Shape:
SQUARE
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
0.65 mm
Supply Current-Max:
6.5 mA
Supply Voltage-Max:
21 V
Supply Voltage-Min:
5 V
Supply Voltage-Nom:
10 V
Supply Voltage1-Max:
21 V
Supply Voltage1-Min:
5 V
Supply Voltage1-Nom:
10 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
40
Width:
4 mm
fmax-Min:
0.0006 MHz

MC34845CEPR2 Frequently Asked Questions (FAQs)

A good thermal design should include a solid ground plane, thermal vias, and a heat sink. The datasheet provides some guidelines, but a more detailed application note or a thermal simulation would be helpful.
The output filter design depends on the specific application and load requirements. A good starting point is to use the recommended component values in the datasheet, and then simulate and optimize the design using tools like LTspice or Falstad.
Operating the device at higher temperatures can reduce its lifespan and affect its performance. Ensure proper thermal design, and consider derating the output current and voltage according to the datasheet's thermal derating curves.
Use a systematic approach to troubleshoot: check the power supply, input voltage, and output voltage. Use an oscilloscope to monitor the waveforms, and consult the datasheet's troubleshooting section and application notes for guidance.
Follow proper PCB layout and design practices to minimize EMI. Use shielding, filtering, and grounding techniques to reduce emissions. Consult the datasheet and relevant industry standards (e.g., CISPR 22) for more information.

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MC34845CEPR2 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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