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MC40XS6500CEK - NXP

Description: Power Switch ICs - Power Distribution High-Side Switch, 12V, Penta 40mOhms, SOIC 32

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Symbol
MC40XS6500CEK - NXP - PCB symbol
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PCB Footprints
MC40XS6500CEK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32-pin SOIC-EP
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3D Models
MC40XS6500CEK - NXP - 3D model - Small Outline Packages - 32-pin SOIC-EP
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MC40XS6500CEK Details

  • Manufacturer Part Number:

    MC40XS6500CEK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    5

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    3.9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    7 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    80 µs

  • Turn-on Time:

    80 µs

  • Width:

    7.5 mm

MC40XS6500CEK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN11524. It's essential to follow these guidelines to ensure proper heat dissipation and minimize electromagnetic interference (EMI).
  • To optimize the MC40XS6500CEK for low power consumption, use the low-power modes (e.g., sleep mode, standby mode) and adjust the clock frequency according to your application's requirements. Additionally, consider using a power management IC (PMIC) to regulate the power supply and reduce power consumption.
  • The MC40XS6500CEK's ADC has limitations in terms of conversion speed, resolution, and input range. The ADC can operate at a maximum conversion rate of 1.2 Msps, has a resolution of 12 bits, and an input range of 0-3.3V. Ensure your application's requirements are within these limitations to achieve accurate conversions.
  • NXP provides a secure boot and firmware update mechanism through their Bootloader and Secure Firmware Update (SFW) tools. Follow the guidelines in the MC40XS6500CEK's security documentation and use the provided tools to implement secure boot and firmware updates in your application.
  • To ensure EMC and minimize EMI, follow proper PCB design and layout guidelines, use shielding and filtering components, and implement electromagnetic shielding techniques. Additionally, consider using a metal casing or shielded enclosure for your device.

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MC40XS6500CEK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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