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MC40XS6500DEK - NXP

Description: Power Switch/Driver 1:6 N-Channel 3.9A 32-HSOP

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MC40XS6500DEK - NXP - PCB symbol
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PCB Footprints
MC40XS6500DEK - NXP PCB footprint - Small Outline Packages - Small Outline Packages - 32-pin SOIC
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MC40XS6500DEK - NXP - 3D model - Small Outline Packages - 32-pin SOIC
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MC40XS6500DEK Details

  • Manufacturer Part Number:

    MC40XS6500DEK

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-32

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7.15

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Driver Number of Bits:

    5

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G32

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    OPEN-DRAIN

  • Output Current Flow Direction:

    SINK

  • Output Current-Max:

    3.9 A

  • Output Peak Current Limit-Nom:

    3.9 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SSOP32,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.45 mm

  • Supply Current-Max:

    8 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    7 V

  • Supply Voltage-Nom:

    14 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    80 µs

  • Turn-on Time:

    80 µs

  • Width:

    7.5 mm

MC40XS6500DEK Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN12213, which includes guidelines for thermal vias, heat sinks, and PCB stack-up.
  • The MC40XS6500DEK requires a well-regulated power supply with low noise and ripple. NXP recommends using a dedicated power supply IC, such as the MC33FS6520, and following the guidelines in the application note AN12214 for power supply design and layout.
  • To ensure EMI and EMC compliance, follow the guidelines in the application note AN12215, which includes recommendations for PCB layout, shielding, and filtering. Additionally, use a qualified EMI filter, such as the NXP PCA9450, and ensure proper grounding and decoupling.
  • NXP provides a secure boot and firmware update solution using their MCUXpresso software development kit (SDK). Follow the guidelines in the MCUXpresso SDK documentation and use the provided tools and libraries to implement secure boot and firmware updates.
  • The MC40XS6500DEK is rated for operation up to 105°C. However, high temperatures can affect the device's performance and reliability. Follow the guidelines in the datasheet and application notes for thermal management and derating, and consider using thermal protection devices, such as thermistors or thermal switches, to prevent overheating.

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MC40XS6500DEK Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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