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MC68EN360FE25V - Motorola

Description: QUad Integrated Communications Controller Users Manual

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PCB Footprints
MC68EN360FE25V - Motorola PCB footprint - Quad Flat Packages - Quad Flat Packages - 240-Pin QFP (FE Suffix)
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3D Models
MC68EN360FE25V - Motorola  - 3D model - Quad Flat Packages - 240-Pin QFP (FE Suffix)
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MC68EN360FE25V Details

  • Manufacturer Part Number:

    MC68EN360FE25V

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CERAMIC, QFP-240

  • HTS Code:

    8542.31.00.25

  • Manufacturer:

    Motorola Semiconductor Products

  • YTEOL:

    0

  • Has ADC:

    NO

  • Address Bus Width:

    32

  • Bit Size:

    32

  • Clock Frequency-Max:

    25 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    32

  • JESD-30 Code:

    S-CQFP-G240

  • JESD-609 Code:

    e0

  • Length:

    31.305 mm

  • Number of I/O Lines:

    46

  • Number of Terminals:

    240

  • Operating Temperature-Max:

    70 °C

  • PWM Channels:

    NO

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP240,1.3SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.15 mm

  • Speed:

    25 MHz

  • Supply Voltage-Max:

    3.3 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    31.305 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

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