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MC7448HX1700LD - NXP

Description: Microprocessors - MPU APL8 RV2.2.1 1.3V 105C

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Symbol
MC7448HX1700LD - NXP - PCB symbol
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PCB Footprints
MC7448HX1700LD - NXP PCB footprint - BGA - BGA - 360 HCTE BGA
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3D Models
MC7448HX1700LD - NXP - 3D model - BGA - 360 HCTE BGA
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MC7448HX1700LD Details

  • Manufacturer Part Number:

    MC7448HX1700LD

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITC, CERAMIC, BGA-360

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.1

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    36

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    200 MHz

  • External Data Bus Width:

    64

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • JESD-30 Code:

    S-CBGA-B360

  • JESD-609 Code:

    e0

  • Length:

    25 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    360

  • Operating Temperature-Max:

    105 °C

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA360,19X19,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.8 mm

  • Speed:

    1700 MHz

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.25 V

  • Supply Voltage-Nom:

    1.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    25 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROPROCESSOR, RISC

MC7448HX1700LD Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guide in their application note AN5071. It's essential to follow these guidelines to ensure optimal performance, reduce thermal resistance, and prevent overheating.
  • The MC7448HX1700LD has multiple power modes. To configure the device for optimal power management, refer to the device's datasheet and application notes AN5071 and AN5072. These resources provide guidance on setting the power modes, clock frequencies, and voltage regulators to achieve the desired power consumption.
  • To minimize EMI and ensure EMC, follow the guidelines in NXP's application note AN5073. This includes using proper shielding, grounding, and layout techniques, as well as selecting suitable components and materials.
  • NXP provides a debugging guide in their application note AN5074. This resource covers common issues, troubleshooting techniques, and debugging tools. Additionally, engineers can use NXP's development boards and software development kits (SDKs) to facilitate debugging and testing.
  • NXP provides reliability and quality metrics in their datasheet and quality documentation. The company follows a rigorous quality control process, including testing, inspection, and certification to ensure the device meets industry standards and customer requirements.

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MC7448HX1700LD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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