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MC74AC163DR2G - onsemi

Description: Outputs Source/Sink 24 mA; ACT161 and ACT163 Have TTL Compatible Inputs; Synchronous Counting and Loading; Typical Count Rate of 125 MHz; High-Speed Synchronous Expansion; These devices are available in Pb-free package(s). Specifications herein apply to both standard and Pb-free devices. Please see our website at www.onsemi.com for specific Pb-free orderable part numbers, or contact your local ON Semiconductor sales office or representative.

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MC74AC163DR2G - onsemi - PCB symbol
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PCB Footprints
MC74AC163DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 CASE751B-05
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MC74AC163DR2G - onsemi - 3D model - Small Outline Packages - SOIC-16 CASE751B-05
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MC74AC163DR2G Details

  • Manufacturer Part Number:

    MC74AC163DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Additional Feature:

    TCO OUTPUT

  • Count Direction:

    UP

  • Family:

    AC

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Load/Preset Input:

    NO

  • Logic IC Type:

    BINARY COUNTER

  • Max Frequency@Nom-Sup:

    60000000 Hz

  • Max I(ol):

    0.012 A

  • Mode of Operation:

    SYNCHRONOUS

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    13.5 ns

  • Propagation Delay (tpd):

    13.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trigger Type:

    POSITIVE EDGE

  • Width:

    3.9 mm

  • fmax-Min:

    95 MHz

MC74AC163DR2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MC74AC163DR2G is 2.0V to 6.0V.
  • To ensure reliable operation in high-temperature environments, ensure that the device is operated within the recommended temperature range of -40°C to 85°C, and that the device is properly heat-sinked to prevent overheating.
  • The maximum clock frequency that the MC74AC163DR2G can handle is 100 MHz.
  • The MC74AC163DR2G is a CMOS device and can be interfaced with other CMOS or TTL devices. Ensure that the voltage levels and logic levels are compatible, and use appropriate pull-up or pull-down resistors as needed.
  • The power consumption of the MC74AC163DR2G depends on the operating frequency and voltage. At 5V and 100 MHz, the typical power consumption is around 20 mW.

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