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MC74AC257DR2G - onsemi

Description: ACT257 Has TTL Compatible Inputs; Noninverting 3-State Outputs; Outputs Source/Sink 24 mA; Multiplexer Expansion by Tying Outputs Together; These devices are available in Pb-free package(s). Specifications herein apply to both standard and Pb-free devices. Please see our website at www.onsemi.com for specific Pb-free orderable part numbers, or contact your local ON Semiconductor sales office or representative.

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MC74AC257DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 CASE751B-05
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MC74AC257DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-16 CASE751B-05
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MC74AC257DR2G Details

  • Manufacturer Part Number:

    MC74AC257DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Package Description:

    SO-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Family:

    AC

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    MULTIPLEXER

  • Max I(ol):

    0.012 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    9 ns

  • Propagation Delay (tpd):

    9 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC74AC257DR2G Frequently Asked Questions (FAQs)

  • The maximum frequency of operation for the MC74AC257DR2G is typically 100 MHz, but it can vary depending on the specific application and operating conditions.
  • To ensure signal integrity, use proper PCB layout techniques, such as minimizing trace lengths, using ground planes, and avoiding signal reflections. Additionally, use termination resistors and decoupling capacitors as needed.
  • The power consumption of the MC74AC257DR2G is typically around 10-20 mA, depending on the operating frequency and output load. However, this can vary depending on the specific application and operating conditions.
  • Yes, the MC74AC257DR2G is compatible with 3.3V systems. However, ensure that the input and output voltage levels are within the recommended operating range of 2.0V to 5.5V.
  • To handle thermal considerations, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power dissipation for extended periods.

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MC74AC257DR2G Overview

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