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MC74HC238ADR2G - onsemi

Description: Output Drive Capability: 10 LSTTL Loads; Outputs Directly Interface to CMOS, NMOS and TTL; Operating Voltage Range: 2.0 to 6.0 V; Low Input Current: 1.0 µA; High Noise Immunity Characteristic of CMOS Devices; In Compliance with the Requirements Defined by JEDEC Standard No. 7A; Chip Complexity: 100 FETs or 29 Equivalent Gates; These are PbFree Devices

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PCB Footprints
MC74HC238ADR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC−16 CASE 751B−05 ISSUE K_2021
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MC74HC238ADR2G - onsemi  - 3D model - Small Outline Packages - SOIC−16 CASE 751B−05 ISSUE K_2021
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MC74HC238ADR2G Details

  • Manufacturer Part Number:

    MC74HC238ADR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.35

  • Family:

    HC/UH

  • Input Conditioning:

    STANDARD

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    3-LINE TO 8-LINE DECODER

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power Supply Current-Max (ICC):

    50 mA

  • Prop. Delay@Nom-Sup:

    41 ns

  • Propagation Delay (tpd):

    205 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC74HC238ADR2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MC74HC238ADR2G is 2.0V to 6.0V.
  • The MC74HC238ADR2G has a specific pinout configuration. Refer to the datasheet or the onsemi website for the correct pinout diagram to ensure proper connection.
  • The maximum clock frequency supported by the MC74HC238ADR2G is 25 MHz.
  • The MC74HC238ADR2G has a maximum junction temperature of 150°C. Ensure proper thermal design and heat dissipation to prevent overheating.
  • The recommended storage temperature range for the MC74HC238ADR2G is -65°C to 150°C.

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MC74HC238ADR2G Overview

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