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MC74LCX157DR2G - onsemi

Description: 5V Tolerant Inputs - Interface Capability With 5V TTL Logic; LVCMOS Compatible; Designed for 2.3 to 3.6V V CC Operation; ESD Performance: Human Body Model >2000V; Machine Model >200V; Latchup Performance Exceeds 500mA; Near Zero Static Supply Current (10mA) Substantially Reduces System Power Requirements; LVTTL Compatible; 24mA Balanced Output Sink and Source Capability; Pb-Free Packages are Available*

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MC74LCX157DR2G - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-16 CASE751B-05
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MC74LCX157DR2G - onsemi  - 3D model - Small Outline Packages - SOIC-16 CASE751B-05
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MC74LCX157DR2G Details

  • Manufacturer Part Number:

    MC74LCX157DR2G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC 16 LEAD

  • Pin Count:

    16

  • Manufacturer Package Code:

    751B-05

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Load Capacitance (CL):

    50 pF

  • Logic IC Type:

    MULTIPLEXER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Inputs:

    2

  • Number of Outputs:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    5.8 ns

  • Propagation Delay (tpd):

    6.3 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MC74LCX157DR2G Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the MC74LCX157DR2G is 2.3V to 3.6V, with a typical voltage of 3.3V.
  • To ensure signal integrity, use a low-impedance PCB layout, keep signal traces short, and use termination resistors as needed. Also, consider using a signal integrity analysis tool to simulate and optimize your design.
  • No, the MC74LCX157DR2G is not recommended for use in 5V systems. It is designed to operate at 3.3V or lower, and exceeding the maximum recommended voltage can cause damage to the device.
  • To ensure proper operation, power up the VCC pin before applying any input signals, and power down the VCC pin after removing all input signals. Also, ensure that the power rails are sequenced in a way that prevents any input signals from being applied before the VCC pin is fully powered up.
  • The maximum frequency of operation for the MC74LCX157DR2G is 250 MHz, but this can vary depending on the specific application and operating conditions. Consult the datasheet and application notes for more information.

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MC74LCX157DR2G Overview

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