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MC74LCX244DTG - onsemi

Description: IOFF Specification Guarantees High Impedance When VCC = 0V; 5V Tolerant - Interface Capability With 5V TTL Logic; Near Zero Static Supply Current in All Three Logic States (10µA) Substantially Reduces System Power Requirements; Designed for 2.3 to 3.6V VCC Operation; ESD Performance: Human Body Model >2000V; Machine Model >200V; Latchup Performance Exceeds 500mA; Supports Live Insertion and Withdrawal; 24mA Balanced Output Sink and Source Capability; LVTTL Compatible; LVCMOS Compatible; Pb-Free Packages are

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MC74LCX244DTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP-20 CASE 948E-02 ISSUE C
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MC74LCX244DTG - onsemi  - 3D model - Small Outline Packages - TSSOP-20 CASE 948E-02 ISSUE C
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MC74LCX244DTG Details

  • Manufacturer Part Number:

    MC74LCX244DTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP 20 LEAD

  • Pin Count:

    20

  • Manufacturer Package Code:

    9.48

  • Country Of Origin:

    Mainland China, Malaysia

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Control Type:

    ENABLE LOW

  • Family:

    LVC/LCX/Z

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e4

  • Length:

    6.5 mm

  • Logic IC Type:

    BUS DRIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    4

  • Number of Functions:

    2

  • Number of Ports:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    6.5 ns

  • Propagation Delay (tpd):

    7.8 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MC74LCX244DTG Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the MC74LCX244DTG is 100 MHz.
  • Yes, the MC74LCX244DTG is compatible with both 3.3V and 5V systems, making it a versatile buffer for various applications.
  • The propagation delay of the MC74LCX244DTG is typically around 2.5 ns, which is relatively fast for a buffer device.
  • Yes, the MC74LCX244DTG is suitable for high-speed data transmission due to its low propagation delay and high operating frequency.
  • The power consumption of the MC74LCX244DTG is relatively low, with a typical quiescent current of around 10 μA.

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MC74LCX244DTG Overview

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