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MC74LVXC3245DTG - onsemi

Description: Bidirectional Interface Between 3V and 3V/5V Buses; Flexible VCCB Operating Range; Available in SOIC and TSSOP Packages; Functionally Compatible with the 74 Series 245 PIN Pins OE T/R A0-A7 B0-B7; Outputs Source/Sink Up to 24mA; Control Inputs Compatible with TTL Level; Allows B Port and VCCB to Float Simultaneously When OE Is High; Guaranteed Simultaneous Switching Noise Level and Dynamic Threshold Performance; Pb-Free Packages are Available*

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MC74LVXC3245DTG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP24 DT CASE 948H ISSUE B
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MC74LVXC3245DTG - onsemi  - 3D model - Small Outline Packages - TSSOP24 DT CASE 948H ISSUE B
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MC74LVXC3245DTG Details

  • Manufacturer Part Number:

    MC74LVXC3245DTG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP24 7.8x4.4, 0.65P

  • Pin Count:

    24

  • Manufacturer Package Code:

    948H-01

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    3.3V SUPPLY FOR PORT A; 5V SUPPLY FOR PORT B

  • Control Type:

    COMMON CONTROL

  • Count Direction:

    BIDIRECTIONAL

  • Family:

    LV/LV-A/LVX/H

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    7.8 mm

  • Logic IC Type:

    BUS TRANSCEIVER

  • Max I(ol):

    0.024 A

  • Moisture Sensitivity Level:

    1

  • Number of Bits:

    8

  • Number of Functions:

    1

  • Number of Ports:

    2

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP24,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    260

  • Prop. Delay@Nom-Sup:

    9 ns

  • Propagation Delay (tpd):

    9 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.3 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

MC74LVXC3245DTG Frequently Asked Questions (FAQs)

  • The maximum operating frequency of the MC74LVXC3245DTG is 250 MHz.
  • Yes, the MC74LVXC3245DTG is compatible with both 3.3V and 5V systems, making it a versatile component for various applications.
  • The propagation delay of the MC74LVXC3245DTG is typically around 2.5 ns, but this can vary depending on the operating conditions and load capacitance.
  • Yes, the MC74LVXC3245DTG is rated for operation up to 125°C, making it suitable for high-temperature applications.
  • Yes, the MC74LVXC3245DTG has built-in electrostatic discharge (ESD) protection, which helps prevent damage from static electricity.

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MC74LVXC3245DTG Overview

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For a full list of alternate parts for MC74LVXC3245DTG, check out Findchips.com