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MC9S08AW60MFUER - NXP

Description: 60K Flash

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PCB Footprints
MC9S08AW60MFUER - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - SOT1697-1
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3D Models
MC9S08AW60MFUER - NXP  - 3D model - Quad Flat Packages - SOT1697-1
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MC9S08AW60MFUER Details

  • Manufacturer Part Number:

    MC9S08AW60MFUER

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    YES

  • CPU Family:

    HCS08

  • Clock Frequency-Max:

    16 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    54

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP64,.63SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    2048

  • ROM (words):

    63280

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Speed:

    40 MHz

  • Supply Current-Max:

    18.5 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S08AW60MFUER Frequently Asked Questions (FAQs)

  • The MC9S08AW60MFUER can operate from -40°C to 105°C, but the maximum junction temperature is 150°C.
  • The internal clock source can be configured using the SYNR and REFS registers. The SYNR register sets the clock source, and the REFS register sets the clock frequency. Refer to the device's reference manual for more information.
  • The maximum current that can be sourced or sunk by the GPIO pins is 25 mA. However, the total current sourced or sunk by all GPIO pins should not exceed 100 mA.
  • The ADC module can be used by configuring the ADCSC1 and ADCSC2 registers. The ADCSC1 register sets the ADC clock, and the ADCSC2 register sets the ADC mode and channel. Refer to the device's reference manual for more information.
  • The COP module is a watchdog timer that resets the microcontroller if it fails to respond within a specified time period. This is useful for detecting and recovering from software faults.

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MC9S08AW60MFUER Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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