MC9S08FL16CBM - NXP

MC9S08FL16CBM Details

• Manufacturer Part Number:

  MC9S08FL16CBM

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  SDIP-32

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  YES

• Bit Size:

  8

• Boundary Scan:

  YES

• Clock Frequency-Max:

  20 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• JESD-30 Code:

  R-PDIP-T32

• JESD-609 Code:

  e3

• Length:

  28.1 mm

• Number of I/O Lines:

  30

• Number of Terminals:

  32

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SDIP

• Package Equivalence Code:

  SDIP32,.4

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE, SHRINK PITCH

• Packing Method:

  TUBE

• Qualification Status:

  Not Qualified

• RAM (bytes):

  1024

• ROM (words):

  16384

• ROM Programmability:

  FLASH

• Seated Height-Max:

  4.9 mm

• Speed:

  20 MHz

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  5 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  NO

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  1.778 mm

• Terminal Position:

  DUAL

• Width:

  8.89 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER