MC9S08PA16AVTG - NXP

MC9S08PA16AVTG Details

• Manufacturer Part Number:

  MC9S08PA16AVTG

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Package Description:

  TSSOP-16

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  5

• Has ADC:

  YES

• Bit Size:

  8

• Boundary Scan:

  NO

• CPU Family:

  HCS08

• Clock Frequency-Max:

  20 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  R-PDSO-G16

• JESD-609 Code:

  e3

• Length:

  5 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of External Interrupts:

  1

• Number of I/O Lines:

  14

• Number of Serial I/Os:

  2

• Number of Terminals:

  16

• Number of Timers:

  9

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  105 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP16,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Peak Reflow Temperature (Cel):

  260

• RAM (bytes):

  2048

• ROM (words):

  16384

• ROM Programmability:

  FLASH

• Seated Height-Max:

  1.2 mm

• Speed:

  20 MHz

• Supply Current-Max:

  15 mA

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  2.7 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Tin (Sn)

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  4.4 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER