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MC9S08PA16AVTJR - NXP

Description: 8-bit Microcontrollers - MCU 8 BIT,HCS08L Core,16k Flash

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PCB Footprints
MC9S08PA16AVTJR - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT360-2
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3D Models
MC9S08PA16AVTJR - NXP  - 3D model - Small Outline Packages - SOT360-2
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MC9S08PA16AVTJR Details

  • Manufacturer Part Number:

    MC9S08PA16AVTJR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-20

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    S08

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    6.5 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    18

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    20

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP20,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    2048

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    20 MHz

  • Supply Current-Max:

    14 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S08PA16AVTJR Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the MC9S08PA16AVTJR is 20 MHz.
  • The internal oscillator on the MC9S08PA16AVTJR can be configured using the OSCCLK and OSCST registers. Refer to the datasheet for specific register settings and configuration options.
  • The VREF pin on the MC9S08PA16AVTJR is used as a reference voltage for the analog-to-digital converter (ADC). It should be connected to a stable voltage source, typically VCC or an external reference voltage.
  • The ADC on the MC9S08PA16AVTJR can be used by configuring the ADCSC1 and ADCSC2 registers, selecting the desired channel, and starting the conversion using the ADST bit. Refer to the datasheet for specific register settings and conversion sequences.
  • The maximum current that can be sourced or sunk by the GPIO pins on the MC9S08PA16AVTJR is 25 mA.

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MC9S08PA16AVTJR Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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