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MC9S08PA16AVWJR - NXP

Description: 8-bit Microcontrollers - MCU 8 BIT,HCS08L Core, 16k Flash

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PCB Footprints
MC9S08PA16AVWJR - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT163-5
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3D Models
MC9S08PA16AVWJR - NXP  - 3D model - Small Outline Packages - SOT163-5
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MC9S08PA16AVWJR Details

  • Manufacturer Part Number:

    MC9S08PA16AVWJR

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-20

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    8

  • Boundary Scan:

    NO

  • CPU Family:

    S08

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.8 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    1

  • Number of I/O Lines:

    18

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    20

  • Number of Timers:

    9

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • RAM (bytes):

    2048

  • ROM (words):

    16384

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2.65 mm

  • Speed:

    20 MHz

  • Supply Current-Max:

    14 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S08PA16AVWJR Frequently Asked Questions (FAQs)

  • The MC9S08PA16AVWJR can operate from -40°C to 105°C, but the maximum junction temperature is 150°C.
  • The internal clock source can be configured using the SYNR and REFS registers. The SYNR register sets the clock source, and the REFS register sets the clock frequency. Refer to the device's reference manual for more information.
  • The maximum current that can be sourced or sunk by the GPIO pins is 25 mA. However, the total current sourced or sunk by all GPIO pins should not exceed 100 mA.
  • The built-in ADC can be used by configuring the ADCSC1 and ADCSC2 registers. The ADCSC1 register sets the ADC clock, and the ADCSC2 register sets the ADC mode and channel. Refer to the device's reference manual for more information.
  • The minimum voltage for the VDD power supply is 2.7V, and the maximum voltage is 5.5V.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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