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MC9S12C32MFAE16 - NXP

Description: 16-bit HCS12 core: — HCS12 CPU – Upward compatible with M68HC11 instruction set – Interrupt stacking and programmer’s model identical to M68HC11 – Instruction queue – Enhanced indexed addressing — MMC (memory map and interface) — INT (interrupt control) — BDM (background debug mode) — DBG12 (enhanced debug12 module, including breakpoints and change-of-flow trace buffer) — MEBI (multiplexed expansion bus interface) available only in 80-pin package version • Wake-up interrupt inputs: — Up to 12 po

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PCB Footprints
MC9S12C32MFAE16 - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 48-Pin LQFP
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3D Models
MC9S12C32MFAE16 - NXP  - 3D model - Quad Flat Packages - 48-Pin LQFP
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MC9S12C32MFAE16 Details

  • Manufacturer Part Number:

    MC9S12C32MFAE16

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    PLASTIC, LQFP-48

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Has ADC:

    YES

  • Additional Feature:

    ALSO REQUIRES 5V SUPPLY

  • Address Bus Width:

    16

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    CPU12

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G48

  • JESD-609 Code:

    e3

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    31

  • Number of Terminals:

    48

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP48,.35SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    2048

  • ROM (words):

    32768

  • ROM Programmability:

    FLASH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.6 mm

  • Speed:

    16 MHz

  • Supply Current-Max:

    45 mA

  • Supply Voltage-Max:

    2.75 V

  • Supply Voltage-Min:

    2.35 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S12C32MFAE16 Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the MC9S12C32MFAE16 is 25 MHz.
  • The MC9S12C32MFAE16 has 32 KB of flash memory.
  • The operating voltage range of the MC9S12C32MFAE16 is 2.7V to 5.5V.
  • No, the MC9S12C32MFAE16 does not have built-in EEPROM. However, it has a 1 KB non-volatile memory block that can be used for data storage.
  • The maximum current consumption of the MC9S12C32MFAE16 is 15 mA at 25 MHz and 3.3V supply voltage.

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MC9S12C32MFAE16 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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For a full list of alternate parts for MC9S12C32MFAE16, check out Findchips.com