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MC9S12E128CFUE - NXP

Description: Microcontroller

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MC9S12E128CFUE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - MC9S12P128MQK
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MC9S12E128CFUE - NXP  - 3D model - Quad Flat Packages - MC9S12P128MQK
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MC9S12E128CFUE Details

  • Manufacturer Part Number:

    MC9S12E128CFUE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    PLASTIC, QFP-80

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    6

  • Has ADC:

    YES

  • Additional Feature:

    ALSO REQUIRES 3.3V OR 5V SUPPLY

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    50 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G80

  • JESD-609 Code:

    e3

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    60

  • Number of Terminals:

    80

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2.45 mm

  • Speed:

    25 MHz

  • Supply Voltage-Max:

    2.75 V

  • Supply Voltage-Min:

    2.35 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S12E128CFUE Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 25 MHz. However, it's recommended to use a crystal oscillator or an external clock source for more accurate and stable clocking.
  • To configure the watchdog timer to reset the MCU, set the WDTCSR register to enable the watchdog timer and set the timeout period using the WDTPR register. Make sure to clear the WDTCSR register before enabling the watchdog timer to avoid an immediate reset.
  • Yes, the MC9S12E128CFUE has 128 KB of internal flash memory that can be used to store data. However, keep in mind that the flash memory has a limited number of erase cycles, so it's recommended to use it for storing configuration data or firmware updates rather than frequently changing data.
  • To implement a bootloader using the MCU's internal flash memory, you'll need to reserve a portion of the flash memory for the bootloader code and configure the MCU to boot from that location. You'll also need to implement a communication protocol to transfer the firmware update to the MCU. Consult the MCU's datasheet and application notes for more information.
  • The maximum current that can be sourced or sunk by the MCU's GPIO pins is 25 mA per pin. However, the total current sourced or sunk by all GPIO pins should not exceed 200 mA to avoid overheating the MCU.

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MC9S12E128CFUE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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