MC9S12XEP100MVL - NXP

MC9S12XEP100MVL Details

• Manufacturer Part Number:

  MC9S12XEP100MVL

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Package Description:

  MAPBGA-208

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Has ADC:

  YES

• Address Bus Width:

  23

• Bit Size:

  32

• Boundary Scan:

  NO

• CPU Family:

  S12XE

• Clock Frequency-Max:

  40 MHz

• DAC Channels:

  NO

• DMA Channels:

  NO

• External Data Bus Width:

  16

• Format:

  FIXED POINT

• Integrated Cache:

  NO

• JESD-30 Code:

  S-PBGA-B208

• JESD-609 Code:

  e2

• Length:

  17 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  152

• Number of Serial I/Os:

  13

• Number of Terminals:

  208

• Number of Timers:

  16

• On Chip Data RAM Width:

  8

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA208,16X16,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  65536

• ROM (words):

  1048576

• ROM Programmability:

  FLASH

• Seated Height-Max:

  2 mm

• Speed:

  50 MHz

• Supply Current-Max:

  100 mA

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  3.13 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Nickel/Gold (Ni/Au)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  17 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC