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MC9S12XET256MAG - NXP

Description: 16-bit Microcontrollers - MCU 16BIT 256K FLASH 16K RAM

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MC9S12XET256MAG - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP144 (SOT486-2)_
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MC9S12XET256MAG - NXP  - 3D model - Quad Flat Packages - LQFP144 (SOT486-2)_
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MC9S12XET256MAG Details

  • Manufacturer Part Number:

    MC9S12XET256MAG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-144

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Address Bus Width:

    23

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • CPU Family:

    S12XE

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • External Data Bus Width:

    16

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • Length:

    20 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    119

  • Number of Serial I/Os:

    7

  • Number of Terminals:

    144

  • Number of Timers:

    12

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    16384

  • ROM (words):

    262144

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    50 MHz

  • Supply Current-Max:

    100 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3.13 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    20 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

MC9S12XET256MAG Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the MC9S12XET256MAG is 50 MHz.
  • The internal oscillator on the MC9S12XET256MAG can be configured using the OSCCLK and OSCST registers. Refer to the datasheet for specific register settings and configuration options.
  • The MC9S12XET256MAG has 256 KB of flash memory and 12 KB of RAM.
  • The CAN module on the MC9S12XET256MAG can be configured using the CANCTL, CANBT, and CANMSG registers. Refer to the datasheet for specific register settings and configuration options.
  • The power consumption of the MC9S12XET256MAG varies depending on the operating frequency and mode. Refer to the datasheet for specific power consumption values.

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MC9S12XET256MAG Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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