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MC9S12XF512MLH - NXP

Description: 512K Flash

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PCB Footprints
MC9S12XF512MLH - NXP PCB footprint - Other - Other - QFP50P1200X1200X160-64N
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3D Models
MC9S12XF512MLH - NXP  - 3D model - Other - QFP50P1200X1200X160-64N
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MC9S12XF512MLH Details

  • Manufacturer Part Number:

    MC9S12XF512MLH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    NO

  • CPU Family:

    MC9S12

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of External Interrupts:

    2

  • Number of I/O Lines:

    42

  • Number of Serial I/Os:

    3

  • Number of Terminals:

    64

  • Number of Timers:

    16

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    32768

  • ROM (words):

    524288

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    50 MHz

  • Supply Current-Max:

    110 mA

  • Supply Voltage-Max:

    1.98 V

  • Supply Voltage-Min:

    1.72 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S12XF512MLH Frequently Asked Questions (FAQs)

  • The maximum clock frequency of the MC9S12XF512MLH is 50 MHz.
  • The internal oscillator on the MC9S12XF512MLH can be configured using the OSCCTL register. The oscillator frequency can be set to 4 MHz, 8 MHz, or 16 MHz.
  • The MC9S12XF512MLH has 512 KB of flash memory and 32 KB of RAM.
  • The CAN module on the MC9S12XF512MLH can be configured using the CANCTL register. The module supports CAN 2.0A and CAN 2.0B protocols.
  • The UART on the MC9S12XF512MLH supports baud rates up to 500 kbps.

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MC9S12XF512MLH Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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