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MC9S12XS128MAE - NXP

Description: Microcontroller

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PCB Footprints
MC9S12XS128MAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - QFP64, plastic, quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
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3D Models
MC9S12XS128MAE - NXP  - 3D model - Quad Flat Packages - QFP64, plastic, quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for MC9S12XS128MAE
  • Part Number MC9S12XS128MAE
  • Manufacturer NXP
  • Pin Count 64
  • Part Category Integrated Circuit
  • Package Category Quad Flat Packages
  • Footprint Name Quad Flat Packages - QFP64, plastic, quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body
  • Released Date Jan 11, 2017
  • Last Modified Date Nov 15, 2024 1:35 PM UTC
  • Pinout / Pin List Click Here (Member Only)

MC9S12XS128MAE Details

  • Manufacturer Part Number:

    MC9S12XS128MAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    CPU12

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    44

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    8192

  • ROM (words):

    131072

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    40 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S12XS128MAE Frequently Asked Questions (FAQs)

  • The maximum clock frequency that can be used with the internal oscillator is 24 MHz. However, it's recommended to use a crystal oscillator or an external clock source for more accurate and stable clock signals.
  • The flash memory can be configured to store both code and data by using the Flash Configuration Register (FCR). The FCR allows you to specify the flash memory partitioning and protection. You can use the NXP-provided flash programming tools or third-party tools to configure the flash memory.
  • The maximum current that can be sourced or sunk by the GPIO pins is 25 mA. However, it's recommended to limit the current to 10 mA or less to ensure reliable operation and prevent overheating.
  • The MC9S12XS128MAE has a built-in watchdog timer (COP) that can be used to reset the microcontroller in case of a fault. You can configure the COP timer using the COPCTL register and enable it using the COPEN bit in the COPCTL register.
  • The minimum voltage required for the MC9S12XS128MAE to operate correctly is 2.7V. However, it's recommended to use a voltage regulator to ensure a stable voltage supply and prevent brownout conditions.

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MC9S12XS128MAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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