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MC9S12XS64CAE - NXP

Description: Microcontroller

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PCB Footprints
MC9S12XS64CAE - NXP PCB footprint - Other - Other - QFP50P1200X1200X160-64N
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3D Models
MC9S12XS64CAE - NXP  - 3D model - Other - QFP50P1200X1200X160-64N
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MC9S12XS64CAE Details

  • Manufacturer Part Number:

    MC9S12XS64CAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    CPU12

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    44

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    40 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S12XS64CAE Frequently Asked Questions (FAQs)

  • The maximum clock frequency for the MC9S12XS64CAE is 25 MHz, but it can be overclocked to 30 MHz with some limitations.
  • To get the best possible clock accuracy, use the internal oscillator with a high-frequency crystal (e.g., 16 MHz) and enable the clock monitor to adjust for any deviations.
  • The maximum current that can be sourced or sunk by the GPIO pins is 25 mA, but it's recommended to limit it to 10 mA to ensure reliable operation.
  • Use the COP (Computer Operating Properly) module to implement a watchdog timer. Configure the COP to reset the microcontroller if it doesn't receive a 'kick' signal within a specified time period.
  • Use the External Bus Interface (EBI) to connect to external memory devices. Configure the EBI to match the memory device's timing and interface requirements.

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MC9S12XS64CAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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