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MC9S12XS64MAE - NXP

Description: 128K Flash

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MC9S12XS64MAE - NXP PCB footprint - Quad Flat Packages - Quad Flat Packages - 64 LQFP
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MC9S12XS64MAE - NXP  - 3D model - Quad Flat Packages - 64 LQFP
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MC9S12XS64MAE Details

  • Manufacturer Part Number:

    MC9S12XS64MAE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LQFP-64

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Has ADC:

    YES

  • Bit Size:

    16

  • Boundary Scan:

    YES

  • CPU Family:

    CPU12

  • Clock Frequency-Max:

    40 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    44

  • Number of Terminals:

    64

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Packing Method:

    TRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • ROM (words):

    65536

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.6 mm

  • Speed:

    40 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

MC9S12XS64MAE Frequently Asked Questions (FAQs)

  • The MC9S12XS64MAE can operate from -40°C to 125°C, but the recommended operating temperature range is -40°C to 105°C.
  • The internal clock source can be configured using the Clock Monitor Unit (CMU) module. The CMU module allows you to select the clock source, divide the clock frequency, and enable or disable the clock output.
  • The maximum frequency of the external clock input is 20 MHz.
  • The built-in bootloader can be used to load code into the microcontroller's flash memory. To use the bootloader, connect the microcontroller to a serial interface (such as a UART or USB), and use a terminal program to send the bootloader commands and data.
  • Yes, the MC9S12XS64MAE has several low-power modes, including Stop, Wait, and Doze modes, which can be used to reduce power consumption. Additionally, the microcontroller has a low-power oscillator and a power-down mode for the peripherals.

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MC9S12XS64MAE Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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