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MCEPM-10 - Multicomp Pro

Description: MULTICOMP - MCEPM-10 - SWITCH, DIL, PIANO, SMD, 10WAY

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MCEPM-10 - Multicomp Pro PCB footprint - Other - Other - MCEPM-10-2
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MCEPM-10 Details

  • Manufacturer Part Number:

    MCEPM-10

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.50.90.40

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    6.1

  • Body Breadth:

    6 mm

  • Body Height:

    5 mm

  • Body Length or Diameter:

    25.3 mm

  • Contact Current(DC)-Max:

    0.025 A

  • Contact (DC) Max Rating R Load:

    .025A@24VDC

  • Contact Voltage(DC)-Max:

    24 V

  • Electrical Life:

    2000 Cycle(s)

  • Mounting Feature:

    SURFACE MOUNT-STRAIGHT

  • Number of Switch Sections:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Surface Mount:

    NO

  • Switch Action:

    MOMENTARY

  • Switch Function:

    SPST

  • Switch Type:

    PIANO DIP SWITCH

  • Termination Type:

    SOLDER

MCEPM-10 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for MCEPM-10 is -40°C to 125°C, although it can withstand storage temperatures from -55°C to 150°C.
  • To ensure proper thermal management, it is recommended to provide a heat sink or a thermal pad on the top of the device, and to keep the ambient temperature below 85°C. Additionally, avoid blocking the airflow around the device.
  • The maximum allowed voltage for MCEPM-10 is 10% above the rated voltage, but it is recommended to operate within the specified voltage range to ensure reliability and longevity.
  • Yes, MCEPM-10 is designed to withstand high-vibration environments, but it is recommended to follow the manufacturer's guidelines for vibration testing and to ensure proper mounting and securing of the device.
  • To handle ESD protection for MCEPM-10, it is recommended to follow standard ESD handling procedures, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging. Additionally, ensure that the device is properly grounded during handling and assembly.

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MCEPM-10 Overview

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