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MCF0805B0R50FSTR - Multicomp Pro

Description: MULTICOMP - MCF0805B0R50FSTR - Fuse, Surface Mount, 500 mA, MCF0805B Series, 63 VDC, Fast Acting, 0805

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PCB Footprints
MCF0805B0R50FSTR - Multicomp Pro PCB footprint - Fuses Chip - Fuses Chip - MCF0805
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3D Models
MCF0805B0R50FSTR - Multicomp Pro  - 3D model - Fuses Chip - MCF0805
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MCF0805B0R50FSTR Details

  • Manufacturer Part Number:

    MCF0805B0R50FSTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    0

  • Blow Characteristic:

    FAST

  • Body Breadth:

    1.2 mm

  • Body Length or Diameter:

    2 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • Fuse Size:

    0805

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    TR, 7 INCH

  • Rated Breaking Capacity:

    50 A

  • Rated Current:

    0.5 A

  • Rated Voltage(AC):

    63 V

  • Rated Voltage(DC):

    63 V

  • Surface Mount:

    YES

  • Terminal Shape:

    WRAPAROUND

MCF0805B0R50FSTR Frequently Asked Questions (FAQs)

  • The recommended soldering temperature for the MCF0805B0R50FSTR is between 250°C to 260°C for a maximum of 10 seconds.
  • Yes, the MCF0805B0R50FSTR is compatible with lead-free soldering processes.
  • The maximum power rating for the MCF0805B0R50FSTR is 0.125W.
  • Yes, the MCF0805B0R50FSTR is suitable for high-frequency applications up to 1 GHz.
  • Yes, the MCF0805B0R50FSTR is compliant with RoHS and REACH regulations.

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MCF0805B0R50FSTR Overview

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