MCF52256CVN66 - NXP

MCF52256CVN66 Details

• Manufacturer Part Number:

  MCF52256CVN66

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  13 X 13 MM, ROHS COMPLIANT, MAPBGA-144

• Country Of Origin:

  Mainland China, Malaysia

• ECCN Code:

  3A991.A.2

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  13 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  3

• Has ADC:

  YES

• Bit Size:

  32

• CPU Family:

  COLDFIRE

• Clock Frequency-Max:

  66 MHz

• DAC Channels:

  NO

• DMA Channels:

  YES

• JESD-30 Code:

  S-PBGA-B144

• JESD-609 Code:

  e2

• Length:

  13 mm

• Moisture Sensitivity Level:

  3

• Number of I/O Lines:

  96

• Number of Terminals:

  144

• On Chip Program ROM Width:

  8

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• PWM Channels:

  YES

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  BGA

• Package Equivalence Code:

  BGA144,12X12,40

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• RAM (bytes):

  65536

• ROM (words):

  262144

• ROM Programmability:

  FLASH

• Speed:

  66 MHz

• Supply Voltage-Max:

  3.6 V

• Supply Voltage-Min:

  3.3 V

• Supply Voltage-Nom:

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Gold (Ni/Au)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  13 mm

• uPs/uCs/Peripheral ICs Type:

  MICROCONTROLLER, RISC