MCF5275LCVM166 - NXP

MCF5275LCVM166 Details

• Manufacturer Part Number:

  MCF5275LCVM166

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Not Recommended

• Package Description:

  ROHS COMPLIANT, MAPBGA-196

• Country Of Origin:

  Mainland China

• ECCN Code:

  5A002.A.1

• HTS Code:

  8542.31.00.01

• Factory Lead Time:

  26 Weeks

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  3

• Additional Feature:

  ALSO REQUIRES 3.3V SUPPLY

• Address Bus Width:

  24

• Bit Size:

  32

• Boundary Scan:

  YES

• Clock Frequency-Max:

  83 MHz

• External Data Bus Width:

  32

• Format:

  FIXED POINT

• Integrated Cache:

  YES

• JESD-30 Code:

  S-PBGA-B196

• JESD-609 Code:

  e1

• Length:

  15 mm

• Low Power Mode:

  YES

• Moisture Sensitivity Level:

  3

• Number of Terminals:

  196

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Shape:

  SQUARE

• Package Style:

  GRID ARRAY, LOW PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.6 mm

• Speed:

  166 MHz

• Supply Voltage-Max:

  1.6 V

• Supply Voltage-Min:

  1.4 V

• Supply Voltage-Nom:

  1.5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Gold (Ni/Au)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  15 mm

• uPs/uCs/Peripheral ICs Type:

  MICROPROCESSOR, RISC