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MCIMX353DVM5B - NXP

Description: i.MX35 Applications Processors

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MCIMX353DVM5B - NXP PCB footprint - Other - Other - BGA400C80P20X20_1700X1700X160
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MCIMX353DVM5B Details

  • Manufacturer Part Number:

    MCIMX353DVM5B

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-400

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • Additional Feature:

    IT ALSO OPERATES AT 1.22 TO 1.47 V

  • JESD-30 Code:

    S-PBGA-B400

  • JESD-609 Code:

    e1

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    400

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA400,20X20,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.47 V

  • Supply Voltage-Min:

    1.33 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX353DVM5B Frequently Asked Questions (FAQs)

  • The recommended crystal oscillator frequency for the MCIMX353DVM5B is 24 MHz. However, the device can also support other frequencies such as 16 MHz, 20 MHz, and 25 MHz with proper configuration and calibration.
  • The DDR memory interface on the MCIMX353DVM5B can be configured using the DDR Controller (DDRC) module. The DDRC module is programmed through a set of registers that control the DDR clock, timing, and data transfer. Refer to the MCIMX353DVM5B reference manual and the DDR memory vendor's datasheet for specific configuration details.
  • The maximum operating temperature range for the MCIMX353DVM5B is -40°C to 105°C. However, the device can also be operated at extended temperatures with reduced performance and reliability. Consult the datasheet and NXP's application notes for more information on temperature-related specifications and considerations.
  • The MCIMX353DVM5B supports secure boot through its BootROM and Secure Boot (SB) module. To implement secure boot, you need to generate a secure boot key, create a bootable image, and configure the SB module to authenticate the boot process. Refer to NXP's secure boot application notes and the MCIMX353DVM5B reference manual for detailed instructions.
  • The power consumption characteristics of the MCIMX353DVM5B vary depending on the operating frequency, voltage, and peripheral usage. The device has a typical active power consumption of around 250 mW at 400 MHz and 1.2 V. In low-power modes, the device can consume as low as 10 μW. Consult the datasheet and NXP's power management application notes for more information on power consumption and optimization techniques.

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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