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MCIMX6G0DVM05AB - NXP

Description: SOC i.MX 6UltraLite ARM Cortex A7 289-Pin MAP-BGA Tray

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MCIMX6G0DVM05AB - NXP - PCB symbol
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PCB Footprints
MCIMX6G0DVM05AB - NXP PCB footprint - BGA - BGA - MAPBGA 14 x 14 mm, 0.8 pitch
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3D Models
MCIMX6G0DVM05AB - NXP - 3D model - BGA - MAPBGA 14 x 14 mm, 0.8 pitch
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MCIMX6G0DVM05AB Details

  • Manufacturer Part Number:

    MCIMX6G0DVM05AB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-289

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Date Of Intro:

    2017-05-31

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • JESD-30 Code:

    S-PBGA-B289

  • JESD-609 Code:

    e1

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    289

  • Operating Temperature-Max:

    95 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.32 mm

  • Supply Voltage-Max:

    1.3 V

  • Supply Voltage-Min:

    1.15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6G0DVM05AB Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the MCIMX6G0DVM05AB is -40°C to 105°C. However, it's essential to note that the device can operate at a wider temperature range, but with reduced performance and reliability.
  • To optimize power consumption on the MCIMX6G0DVM05AB, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling (DVFS). Additionally, you can use the device's power management features, such as the Power Management Unit (PMU) and the Dynamic Voltage and Frequency Scaling (DVFS) module.
  • The maximum clock frequency supported by the MCIMX6G0DVM05AB is 1 GHz. However, the actual clock frequency may vary depending on the specific use case and the device's operating conditions.
  • To ensure reliable booting of the MCIMX6G0DVM05AB, you should follow the recommended boot sequence and configuration, as described in the device's datasheet and reference manual. Additionally, you should ensure that the boot media (e.g., NAND flash or SD card) is properly configured and that the boot loader is correctly implemented.
  • The MCIMX6G0DVM05AB's DDR3 memory interface has some limitations, including a maximum memory bandwidth of 4.2 GB/s, a maximum memory capacity of 2 GB, and a limited number of memory banks (2). Additionally, the device's DDR3 memory interface may have specific timing and signal integrity requirements that must be met to ensure reliable operation.

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MCIMX6G0DVM05AB Overview

Use the download button to access the MCIMX6G0DVM05AB schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image MCIMX6G0DVM05AA NXP Semiconductors

SoC, CMOS, PBGA289