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MCIMX6L2EVN10AC - NXP

Description: Processors - Application Specialized i.MX 6 series 32-bit MPU, ARM Cortex-A9 core, 1GHz, MAPBGA 432

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MCIMX6L2EVN10AC - NXP - PCB symbol
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PCB Footprints
MCIMX6L2EVN10AC - NXP PCB footprint - BGA - BGA - 13 x 13 mm, 0.5 mm Pitch
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3D Models
MCIMX6L2EVN10AC - NXP - 3D model - BGA - 13 x 13 mm, 0.5 mm Pitch
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MCIMX6L2EVN10AC Details

  • Manufacturer Part Number:

    MCIMX6L2EVN10AC

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TFBGA-432

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2017-10-13

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PBGA-B432

  • JESD-609 Code:

    e1

  • Length:

    13 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    432

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA432,24X24,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.375 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    13 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6L2EVN10AC Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to first apply the 1.2V to 1.35V core voltage (VDD_CORE), followed by the 2.5V to 3.3V I/O voltage (VDD_IO). This ensures that the internal voltage regulators are properly enabled and stabilized before the CPU and peripherals are powered up.
  • The MCIMX6L2EVN10AC has multiple clock sources, including the internal oscillator, external crystal oscillator, and PLLs. The clock configuration is done through the Clock Control Module (CCM) registers. The recommended approach is to use the internal oscillator as the clock source for the CPU and peripherals, and then switch to an external crystal oscillator or PLL once the system is stable.
  • The MCIMX6L2EVN10AC has an industrial temperature range of -40°C to 105°C, making it suitable for use in a wide range of applications, including industrial control systems, automotive systems, and consumer electronics.
  • The MCIMX6L2EVN10AC has a built-in Secure Boot mechanism that uses a combination of hardware and software to ensure the authenticity and integrity of the boot process. This involves generating a secure boot key, creating a secure boot image, and configuring the Boot Mode Controller (BMC) to use the secure boot mechanism.
  • The MCIMX6L2EVN10AC has a 32-bit DDR3L interface that can support up to 2GB of RAM. However, the actual amount of RAM that can be used depends on the specific application and the memory configuration.

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MCIMX6L2EVN10AC Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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