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MCIMX6S7CVM08AD - NXP

Description: PACKAGE: 21 mm x 21 mm, 0.8 mm pitch, MAPBGA

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MCIMX6S7CVM08AD - NXP - PCB symbol
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PCB Footprints
MCIMX6S7CVM08AD - NXP PCB footprint - BGA - BGA - 21 x 21, 0.8 mm BGA 624
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3D Models
MCIMX6S7CVM08AD - NXP - 3D model - BGA - 21 x 21, 0.8 mm BGA 624
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MCIMX6S7CVM08AD Details

  • Manufacturer Part Number:

    MCIMX6S7CVM08AD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MABGA-624

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    10

  • Additional Feature:

    24 MHZ NOMINAL XTAL FREQUENCY AVAILABLE

  • JESD-30 Code:

    S-PBGA-B624

  • JESD-609 Code:

    e1

  • Length:

    21 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    624

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.275 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    21 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6S7CVM08AD Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are powered up correctly.
  • The clock settings can be configured using the Clock Control Module (CCM) registers. The CCM registers control the clock sources, dividers, and multiplexers. Refer to the i.MX6Solo/6DualLite Applications Processor Reference Manual for detailed information on clock configuration.
  • The maximum operating temperature range for the MCIMX6S7CVM08AD is -40°C to 105°C. However, the recommended operating temperature range is 0°C to 90°C for optimal performance and reliability.
  • Secure boot can be implemented using the High Assurance Boot (HAB) feature. HAB provides a secure boot mechanism that ensures the authenticity and integrity of the boot process. Refer to the i.MX6Solo/6DualLite Applications Processor Reference Manual for detailed information on implementing secure boot.
  • The maximum frequency for the DDR3 interface on the MCIMX6S7CVM08AD is 533 MHz. However, the actual frequency may vary depending on the specific DDR3 memory module used and the system design.

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MCIMX6S7CVM08AD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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