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MCIMX6Y2CVM05ABR - NXP

Description: Single-core Arm Cortex-A7—The single core A7 provides a cost-effective and power-efficient solution. • Multilevel memory system—The multilevel memory system of processor is based on the L1 instruction and data caches, L2 cache, and internal and external memory. The processor supports many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR Flash, NAND Flash (MLC and SLC), OneNAND™, Quad SPI, and managed NAND, including eMMC up to rev 4.4/4.41/4.5. • Smart speed technology—

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PCB Footprints
MCIMX6Y2CVM05ABR - NXP PCB footprint - BGA - BGA - 14*14*1.18 PKG, 0.8MM PITCH, 289
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3D Models
MCIMX6Y2CVM05ABR - NXP  - 3D model - BGA - 14*14*1.18 PKG, 0.8MM PITCH, 289
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MCIMX6Y2CVM05ABR Details

  • Manufacturer Part Number:

    MCIMX6Y2CVM05ABR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MAPBGA-289

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B289

  • JESD-609 Code:

    e1

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    289

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFBGA

  • Package Equivalence Code:

    BGA289,17X17,32

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.32 mm

  • Supply Voltage-Max:

    1.5 V

  • Supply Voltage-Min:

    1.275 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX6Y2CVM05ABR Frequently Asked Questions (FAQs)

  • The MCIMX6Y2CVM05ABR has an operating temperature range of -40°C to 105°C.
  • The DDR memory interface can be configured using the Chip Select (CS) pins and the DDRPHY register settings. Refer to the i.MX6 Dual/Quad Applications Processor Reference Manual for detailed configuration guidelines.
  • The MCIMX6Y2CVM05ABR has a maximum clock speed of 1 GHz.
  • Power management can be implemented using the Power Management Unit (PMU) and the Clock Controller (CCM) registers. Refer to the i.MX6 Dual/Quad Applications Processor Reference Manual for detailed power management guidelines.
  • The MCIMX6Y2CVM05ABR supports various boot modes, including booting from NAND flash, SD/MMC, SPI flash, and UART. The boot mode can be selected using the Boot Mode Select (BMS) pins.

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MCIMX6Y2CVM05ABR Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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