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MCIMX7D3EVK10SD - NXP

Description: NXP - MCIMX7D3EVK10SD - Microprocessor, i.MX Family i.MX 7Dual Series, 32bit, 1GHz, 950mV to 1.05V, MAPBGA-488

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MCIMX7D3EVK10SD - NXP - PCB symbol
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PCB Footprints
MCIMX7D3EVK10SD - NXP PCB footprint - BGA - BGA - 488-TFBGA
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3D Models
MCIMX7D3EVK10SD - NXP - 3D model - BGA - 488-TFBGA
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MCIMX7D3EVK10SD Details

  • Manufacturer Part Number:

    MCIMX7D3EVK10SD

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    FBGA-488

  • ECCN Code:

    5A992.C

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    23 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    9

  • JESD-30 Code:

    S-PBGA-B488

  • Length:

    12 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    488

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA488,28X28,16

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    1.225 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    SoC

MCIMX7D3EVK10SD Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to power up the VDD_HIGH first, followed by VDD_LOW, and then the core voltage (VDD_CORE). This ensures that the internal voltage regulators are powered up correctly.
  • The clock settings can be configured using the Clock Controller (CCM) module. The CCM module allows you to configure the clock sources, dividers, and multiplexers to generate the desired clock frequencies for the various peripherals and interfaces.
  • The maximum operating temperature range for the MCIMX7D3EVK10SD is -40°C to 105°C. However, it's recommended to operate the device within the recommended temperature range of 0°C to 90°C for optimal performance and reliability.
  • Secure boot can be implemented using the Boot Mode Controller (BMC) and the Fuse Box (FB) modules. The BMC module allows you to configure the boot mode, while the FB module allows you to store the boot configuration and security settings in the one-time programmable (OTP) fuses.
  • The maximum frequency for the DDR3L interface on the MCIMX7D3EVK10SD is 1066 MT/s. However, the actual frequency may vary depending on the specific DDR3L memory module used and the system design.

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MCIMX7D3EVK10SD Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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