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MCK12140DG - onsemi

Description: 800 MHz Typical Bandwidth; Small Outline 8-Lead SOIC Package; 75 kΩ Internal Input Pulldown Resistors; > 1000 V ESD Protection; Pb-Free Packages are Available

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MCK12140DG - onsemi - PCB symbol
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PCB Footprints
MCK12140DG - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MCK12140DG - onsemi - 3D model - Small Outline Packages - SOIC-8 NB CASE 751-07 ISSUE AK
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MCK12140DG Details

  • Manufacturer Part Number:

    MCK12140DG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8 Narrow Body

  • Pin Count:

    8

  • Manufacturer Package Code:

    751-07

  • Country Of Origin:

    Philippines

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.4

  • Additional Feature:

    IT REQUIRES A -4.75V TO -5.5V SUPPLY

  • Analog IC - Other Type:

    PHASE LOCKED LOOP

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -4.5 V

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Technology:

    ECL100K

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

MCK12140DG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material to improve heat transfer.
  • Not using the recommended bypass capacitors can lead to instability, noise, and reduced performance. Bypass capacitors help to filter out noise and ensure stable operation.
  • Yes, the MCK12140DG is suitable for high-reliability and automotive applications. However, additional testing and validation may be required to ensure compliance with specific industry standards.
  • Use a systematic approach to troubleshoot issues, starting with a review of the PCB layout, component selection, and soldering quality. Also, consult the datasheet and application notes for guidance on troubleshooting common issues.

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MCK12140DG Overview

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