ANTI-SULFUR, LASER TRIMMABLE, RATED AC VOLTAGE (V): 50
JESD-609 Code:
e3
Mounting Feature:
SURFACE MOUNT
Number of Terminals:
2
Operating Temperature-Max:
155 °C
Operating Temperature-Min:
-55 °C
Package Height:
0.35 mm
Package Length:
1 mm
Package Shape:
RECTANGULAR PACKAGE
Package Style:
SMT
Package Width:
0.5 mm
Packing Method:
TR, PAPER, 7 INCH
Rated Power Dissipation (P):
0.0625 W
Rated Temperature:
70 °C
Reference Standard:
AEC-Q200
Resistance:
3300 Ω
Resistor Type:
FIXED RESISTOR
Size Code:
0402
Surface Mount:
YES
Technology:
METAL GLAZE/THICK FILM
Temperature Coefficient:
100 ppm/°C
Terminal Finish:
Tin (Sn)
Terminal Shape:
WRAPAROUND
Tolerance:
1%
Working Voltage:
50 V
MCMR04X3301FTL Frequently Asked Questions (FAQs)
The recommended land pattern for the MCMR04X3301FTL can be found in the IPC-7351 standard or in the manufacturer's application notes. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal and mechanical stress on the component.
To prevent damage, handle the MCMR04X3301FTL by the body, avoiding touching the leads or the component's surface. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads, and use a pick-and-place machine or a vacuum pickup tool to handle the component during assembly.
The maximum storage temperature for the MCMR04X3301FTL is typically 40°C (104°F) with a relative humidity of 90% or less. Storage above this temperature can affect the component's reliability and lifespan.
The MCMR04X3301FTL is designed to withstand moderate vibration levels. However, it's essential to evaluate the component's performance in your specific application, considering factors like vibration frequency, amplitude, and duration. You may need to add additional mechanical support or use a vibration-dampening material to ensure the component's reliability.
Use a soldering iron with a temperature range of 250°C to 260°C (482°F to 500°F). Apply a small amount of solder paste or flux to the pads, and use a gentle touch to avoid damaging the component. Ensure the soldering process is completed within 3-5 seconds to prevent thermal stress.
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MCMR04X3301FTL Overview
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