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MCMT18N220F500CT - Multicomp Pro

Description: MLCC consists of a conducting material and electrodes. To manufacture a chip-type SMT and achieve miniaturization, high density and high efficiency, ceramic condensers are used. WTC’s MT series MLCC is made by NP0, X7R dielectrics and which provides product with high electrical precision, stability and reliability. Besides, MT series MLCC is tighten controlling in quality in line to assure quality performance in automotive applications.

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MCMT18N220F500CT - Multicomp Pro - PCB symbol
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PCB Footprints
MCMT18N220F500CT - Multicomp Pro PCB footprint - Capacitor Chip Non-polarised - Capacitor Chip Non-polarised - 0603 (1608)
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3D Models
MCMT18N220F500CT - Multicomp Pro - 3D model - Capacitor Chip Non-polarised - 0603 (1608)
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MCMT18N220F500CT Details

  • Manufacturer Part Number:

    MCMT18N220F500CT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Unknown

  • ECCN Code:

    EAR99

  • HTS Code:

    8532.24.00.20

  • Manufacturer:

    SPC Multicomp

  • YTEOL:

    7

  • Capacitance:

    0.000022 µF

  • Capacitor Type:

    CERAMIC CAPACITOR

  • Dielectric Material:

    CERAMIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Multilayer:

    Yes

  • Negative Tolerance:

    1%

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Shape:

    RECTANGULAR PACKAGE

  • Packing Method:

    TR, PAPER, 7 INCH

  • Positive Tolerance:

    1%

  • Rated (DC) Voltage (URdc):

    50 V

  • Reference Standard:

    AEC-Q200

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Temperature Characteristics Code:

    C0G

  • Temperature Coefficient:

    30ppm/Cel ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

MCMT18N220F500CT Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for MCMT18N220F500CT is a rectangular pad with dimensions of 5.5mm x 3.5mm, with a thermal pad of 2.5mm x 2.5mm in the center. The pad should have a solder mask defined (SMD) and a solder paste layer.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder paste with a melting point of 217°C to 221°C. The soldering time should be limited to 3-5 seconds, and the component should be handled by the edges to prevent damage.
  • The maximum operating temperature range for MCMT18N220F500CT is -55°C to 150°C, with a derating of 1.33% per °C above 125°C.
  • Yes, MCMT18N220F500CT is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB.
  • Store MCMT18N220F500CT in a dry, cool place with a relative humidity of 50% or less. Avoid exposing the component to moisture, and use a desiccant or airtight container to store the component.

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MCMT18N220F500CT Overview

Use the download button to access the MCMT18N220F500CT schematic symbol, PCB footprint, and 3D model.
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