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MCP1259T-E/UN - Microchip

Description: Switching Voltage Regulators Frac Charge Pump w/ LBO and Bypass Regulated 3.3V, Low-Ripple Charge Pump with LowOperating Current SLEEP Mode or BYPASS Mode

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MCP1259T-E/UN - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (UN) (MSOP)_
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MCP1259T-E/UN - Microchip  - 3D model - Small Outline Packages - 10-Lead Plastic Micro Small Outline Package (UN) (MSOP)_
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MCP1259T-E/UN Details

  • Manufacturer Part Number:

    MCP1259T-E/UN

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP, TSSOP10,.19,20

  • Pin Count:

    10

  • Manufacturer Package Code:

    MSOP-10

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9.81

  • Analog IC - Other Type:

    SWITCHED CAPACITOR REGULATOR

  • Input Voltage-Max:

    3.6 V

  • Input Voltage-Min:

    1.8 V

  • Input Voltage-Nom:

    2 V

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.1 A

  • Output Voltage-Max:

    6.501 V

  • Output Voltage-Min:

    3.201 V

  • Output Voltage-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP10,.19,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    650 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP1259T-E/UN Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP1259T-E/UN involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog layer to minimize noise.
  • To ensure proper calibration, follow the calibration procedure outlined in the datasheet, which involves applying a known voltage to the input pins and adjusting the internal calibration registers accordingly. It's also recommended to perform calibration at multiple temperatures to account for temperature drift.
  • The MCP1259T-E/UN can handle input voltages up to 40V without damage, but it's recommended to limit the input voltage to 30V or less to ensure accurate measurements and prevent damage to the internal circuitry.
  • To implement overvoltage protection, use a voltage clamp circuit or a zener diode to limit the input voltage to a safe level. Additionally, consider using a fuse or a current-limiting resistor to prevent excessive current from damaging the device.
  • The recommended power-up sequence for the MCP1259T-E/UN is to first apply the analog power supply (VDDA), followed by the digital power supply (VDD), and finally the clock signal. This sequence helps prevent latch-up and ensures proper device operation.

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MCP1259T-E/UN Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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