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MCP14A0052T-E/CH - Microchip

Description: Gate Drivers MOSFET Driver 0.5A single, SOT-23

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PCB Footprints
MCP14A0052T-E/CH - Microchip PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - (CH) [SOT-23]
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3D Models
MCP14A0052T-E/CH - Microchip  - 3D model - SOT23 (6-Pin) - (CH) [SOT-23]
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MCP14A0052T-E/CH Details

  • Manufacturer Part Number:

    MCP14A0052T-E/CH

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT-23-6

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • High Side Driver:

    YES

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    BUFFER OR INVERTER BASED MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    TOTEM-POLE

  • Output Peak Current Limit-Nom:

    0.5 A

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.45 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage1-Max:

    18 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Turn-off Time:

    0.096 µs

  • Turn-on Time:

    0.08 µs

  • Width:

    1.55 mm

MCP14A0052T-E/CH Frequently Asked Questions (FAQs)

  • A good PCB layout for the MCP14A0052T-E/CH involves keeping the input and output traces short and away from noise sources, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliability in high-temperature applications, ensure that the device is operated within its recommended operating temperature range, use a heat sink if necessary, and follow proper PCB design and layout guidelines. Additionally, consider using a thermally conductive material for the PCB substrate.
  • The MCP14A0052T-E/CH has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
  • Yes, the MCP14A0052T-E/CH can be used in high-frequency applications, but it's essential to consider the device's frequency response and ensure that the PCB layout is optimized for high-frequency operation. Use a 4-layer PCB with a dedicated power plane and a solid ground plane to minimize signal loss and noise.
  • To troubleshoot issues with the MCP14A0052T-E/CH, start by verifying the power supply voltage and ensuring that the device is properly biased. Check the input and output signals using an oscilloscope, and verify that the PCB layout is correct. Consult the datasheet and application notes for troubleshooting guidelines.

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MCP14A0052T-E/CH Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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