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MCP1602-250I/MS - Microchip

Description: Voltage Regulators - Switching Regulators 20MHz 05A Synch-Buck PFM/PWM Reg

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MCP1602-250I/MS - Microchip - PCB symbol
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MCP1602-250I/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - MSOP
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MCP1602-250I/MS - Microchip - 3D model - Small Outline Packages - MSOP
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MCP1602-250I/MS Details

  • Manufacturer Part Number:

    MCP1602-250I/MS

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    PLASTIC, MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    9

  • Additional Feature:

    IT CAN ALSO OPERATE WITH PULSE FREQUENCY MODULATION

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    2.7 V

  • Input Voltage-Nom:

    3.6 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    2.5625 V

  • Output Voltage-Min:

    2.4375 V

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2400 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP1602-250I/MS Frequently Asked Questions (FAQs)

  • Microchip provides a recommended PCB layout in the MCP1602 datasheet, which includes guidelines for component placement, routing, and grounding. Additionally, it's recommended to use a solid ground plane, keep analog and digital signals separate, and use decoupling capacitors to minimize noise.
  • The MCP1602-250I/MS requires a single 2.5V power supply. It's recommended to use a low-noise, low-dropout regulator (LDO) to power the device. Power sequencing is not critical, but it's recommended to power up the device after the input voltage has stabilized to prevent latch-up or other issues.
  • The maximum input voltage that can be applied to the MCP1602-250I/MS is 5.5V, which is the absolute maximum rating. However, it's recommended to keep the input voltage within the recommended operating range of 2.2V to 2.7V to ensure optimal performance and prevent damage.
  • The output voltage of the MCP1602-250I/MS can be calculated using the following formula: VOUT = (VIN x (R1 + R2) / R2), where VIN is the input voltage, R1 and R2 are the resistors in the feedback network, and VOUT is the desired output voltage.
  • The typical output noise of the MCP1602-250I/MS is around 10uVrms. To minimize output noise, it's recommended to use a low-noise input voltage, keep the PCB layout clean and well-grounded, and use decoupling capacitors to filter out high-frequency noise.

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MCP1602-250I/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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