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MCP16311T-E/MNY - Microchip

Description: Microchip, MCP16311T-E/MNY Step Down DC-DC Converter 1A Adjustable, 2 → 24 V 8-Pin, TDFN

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MCP16311T-E/MNY - Microchip PCB footprint - Small Outline No-lead - Small Outline No-lead - 8-Lead Plastic DFN (MN) 2x3x0.75mm
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MCP16311T-E/MNY - Microchip  - 3D model - Small Outline No-lead - 8-Lead Plastic DFN (MN) 2x3x0.75mm
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MCP16311T-E/MNY Details

  • Manufacturer Part Number:

    MCP16311T-E/MNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    TDFN-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 2 TO 24V; ALSO REQUIRE PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    4.4 V

  • Input Voltage-Nom:

    7 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    2 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    1.1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    575 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    3 mm

MCP16311T-E/MNY Frequently Asked Questions (FAQs)

  • The recommended input capacitor value is 10uF to 22uF, depending on the input voltage and output current requirements. A larger capacitor value can help to reduce input voltage ripple and improve output voltage regulation.
  • To ensure stability, it's essential to follow the recommended PCB layout guidelines, use a sufficient output capacitor value (typically 10uF to 22uF), and ensure that the input voltage is within the recommended range. Additionally, the output voltage can be adjusted using the FB pin, and the EN pin can be used to enable or disable the output voltage.
  • The maximum output current capability of the MCP16311T-E/MNY is 1A. However, the actual output current capability may be limited by the input voltage, output voltage, and thermal considerations. It's essential to consult the datasheet and application notes for more information.
  • The MCP16311T-E/MNY has built-in overvoltage protection (OVP) and undervoltage lockout (UVLO) features. However, additional protection can be achieved by using external components such as voltage supervisors, TVS diodes, or zener diodes to protect the device from voltage transients and faults.
  • The thermal derating curve for the MCP16311T-E/MNY can be found in the datasheet. The device's power dissipation capability decreases as the ambient temperature increases. It's essential to consult the datasheet and application notes to ensure that the device operates within its recommended thermal specifications.

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MCP16311T-E/MNY Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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