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MCP16312-E/MS - Microchip

Description: Microchip, MCP16312-E/MS Step-Down Switching Regulator 1A Adjustable, 2 → 24 V, 8-Pin MSOP

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MCP16312-E/MS - Microchip - PCB symbol
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PCB Footprints
MCP16312-E/MS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 8 Lead MS MSOP
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MCP16312-E/MS - Microchip - 3D model - Small Outline Packages - 8 Lead MS MSOP
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MCP16312-E/MS Details

  • Manufacturer Part Number:

    MCP16312-E/MS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    8

  • Manufacturer Package Code:

    MSOP-8

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    19 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Additional Feature:

    ALSO OPERATES IN ADJUSTABLE MODE FROM 2 TO 24V; ALSO REQUIRE PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    30 V

  • Input Voltage-Min:

    4.4 V

  • Input Voltage-Nom:

    7 V

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    24 V

  • Output Voltage-Min:

    2 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Screening Level:

    AEC-Q100; TS 16949

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    575 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    2 mm

MCP16312-E/MS Frequently Asked Questions (FAQs)

  • Microchip provides a recommended layout and placement guide in the MCP16312-E/MS evaluation board user's guide, which can be found on the Microchip website. It's essential to follow this guide to ensure proper operation and minimize noise and EMI.
  • The compensation network requires careful design and optimization for the specific application. Microchip provides a compensation design tool and guidelines in the datasheet and application notes. It's recommended to use these resources and consult with Microchip's technical support team if needed.
  • The MCP16312-E/MS has a maximum junction temperature of 150°C. Ensure proper thermal design, including heat sinking and airflow, to keep the device within the recommended operating temperature range. Consult the datasheet and Microchip's thermal design guidelines for more information.
  • Follow proper PCB layout and design guidelines, use shielding and filtering components as needed, and ensure proper grounding and decoupling. Microchip provides EMC design guidelines and application notes that can help minimize EMI and ensure EMC compliance.
  • Microchip provides testing and validation guidelines in the datasheet and application notes. It's essential to follow these guidelines to ensure the device is properly tested and validated for the specific application.

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MCP16312-E/MS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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