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MCP1701AT-2502I/CB - Microchip

Description: 3

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MCP1701AT-2502I/CB - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - CB-SOT-23A
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MCP1701AT-2502I/CB - Microchip  - 3D model - SOT23 (3-Pin) - CB-SOT-23A
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MCP1701AT-2502I/CB Details

  • Manufacturer Part Number:

    MCP1701AT-2502I/CB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23A

  • Package Description:

    PLASTIC, EIAJ, SC-59, SOT-23A, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23A-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.7 V

  • Dropout Voltage1-Nom:

    0.4 V

  • Input Voltage Absolute-Max:

    12 V

  • Input Voltage-Max:

    10 V

  • Input Voltage-Min:

    3.5 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.04875%

  • Load Regulation-Max:

    0.09%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.125 A

  • Output Voltage1-Max:

    2.55 V

  • Output Voltage1-Min:

    2.45 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.5 mm

MCP1701AT-2502I/CB Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the MCP1701AT-2502I/CB is 16V, but it's recommended to operate within the specified input voltage range of 2.7V to 13.2V for optimal performance and reliability.
  • To ensure the output voltage is stable and accurate, make sure to use a suitable output capacitor (e.g., 1uF to 10uF) and follow the recommended PCB layout guidelines to minimize noise and parasitic inductance. Additionally, ensure the input voltage is within the specified range and the device is operated within the recommended temperature range.
  • The maximum output current that the MCP1701AT-2502I/CB can deliver is 250mA. However, it's recommended to operate within the specified output current range of 1mA to 150mA for optimal performance and reliability.
  • To protect the MCP1701AT-2502I/CB from overcurrent and overheating, use a suitable output current limiting resistor, and ensure the device is operated within the recommended temperature range (–40°C to +125°C). Additionally, consider using thermal management techniques such as heat sinks or thermal pads to dissipate heat.
  • While the MCP1701AT-2502I/CB can operate up to 125°C, it's recommended to derate the output current and ensure proper thermal management to prevent overheating. Consult the datasheet and application notes for more information on high-temperature operation.

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MCP1701AT-2502I/CB Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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