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MCP1703AT-2802E/CB - Microchip

Description: LDO Voltage Regulators LOW Iq, High Vin LDO 2.8V, SOT-23A

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PCB Footprints
MCP1703AT-2802E/CB - Microchip PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - 3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]
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3D Models
MCP1703AT-2802E/CB - Microchip  - 3D model - SOT23 (3-Pin) - 3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]
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MCP1703AT-2802E/CB Details

  • Manufacturer Part Number:

    MCP1703AT-2802E/CB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23A, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-23A-3

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    13

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.975 V

  • Dropout Voltage1-Nom:

    0.625 V

  • Input Voltage Absolute-Max:

    18 V

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    3.831 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.1022196%

  • Load Regulation-Max:

    0.07%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    2.884 V

  • Output Voltage1-Min:

    2.716 V

  • Output Voltage1-Nom:

    2.8 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    3%

  • Width:

    1.5 mm

MCP1703AT-2802E/CB Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the MCP1703AT-2802E/CB is 16V, but it's recommended to operate within the specified input voltage range of 2.7V to 13.2V for optimal performance and reliability.
  • To ensure the output voltage is stable and accurate, make sure to use a suitable output capacitor (e.g., 1uF to 10uF) and follow the recommended PCB layout guidelines to minimize noise and parasitic inductance. Additionally, ensure that the input voltage is within the specified range and the device is operated within its recommended operating conditions.
  • The maximum output current that the MCP1703AT-2802E/CB can deliver is 250mA. However, it's recommended to operate within the specified output current range of 1mA to 150mA for optimal performance and reliability.
  • To protect the MCP1703AT-2802E/CB from overvoltage and undervoltage conditions, consider using external voltage protection devices such as TVS diodes or voltage supervisors. Additionally, ensure that the input voltage is within the specified range and the device is operated within its recommended operating conditions.
  • The thermal shutdown temperature of the MCP1703AT-2802E/CB is typically around 150°C to 160°C. When the device temperature exceeds this threshold, it will shut down to prevent damage.

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MCP1703AT-2802E/CB Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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