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MCP1703T-2502E/DB - Microchip

Description: LDO Voltage Regulators Low Iq 250mA LDO Vin 16V maxVout 2.5V

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PCB Footprints
MCP1703T-2502E/DB - Microchip PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - (DB) [SOT-223
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3D Models
MCP1703T-2502E/DB - Microchip  - 3D model - SOT223 (3-Pin) - (DB) [SOT-223
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MCP1703T-2502E/DB Details

  • Manufacturer Part Number:

    MCP1703T-2502E/DB

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-223

  • Package Description:

    SOT-223, 4 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-223-3

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    8

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    1.1 V

  • Dropout Voltage1-Nom:

    0.75 V

  • Input Voltage Absolute-Max:

    18 V

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    3.6 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.093%

  • Load Regulation-Max:

    0.0625%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.25 A

  • Output Voltage1-Max:

    2.55 V

  • Output Voltage1-Min:

    2.45 V

  • Output Voltage1-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOT-223

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.5 mm

MCP1703T-2502E/DB Frequently Asked Questions (FAQs)

  • The maximum input voltage that can be applied to the MCP1703T-2502E/DB is 16V, but it's recommended to operate within the specified input voltage range of 2.7V to 13.2V for optimal performance and reliability.
  • To ensure the output voltage is stable and accurate, make sure to follow proper PCB layout guidelines, use a suitable output capacitor, and minimize noise and ripple on the input voltage. Additionally, ensure that the input voltage is within the specified range and that the device is operated within its recommended operating conditions.
  • The minimum input capacitance required for the MCP1703T-2502E/DB is 1uF, but it's recommended to use a higher value (e.g., 4.7uF or 10uF) to ensure stable operation and minimize input voltage ripple.
  • The MCP1703T-2502E/DB is rated for operation up to 125°C, but its performance and reliability may degrade at high temperatures. It's recommended to derate the output current and ensure proper thermal management to prevent overheating.
  • The output voltage tolerance of the MCP1703T-2502E/DB is specified as ±2% over the operating temperature range. To calculate the output voltage tolerance, multiply the nominal output voltage by the tolerance percentage (e.g., 2.5V x 2% = ±0.05V).

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MCP1703T-2502E/DB Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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