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MCP1755ST-3302E/DB - Microchip

Description: MICROCHIP - MCP1755ST-3302E/DB - Fixed LDO Voltage Regulator, 3.6 V to 16 V, 300 mV Dropout, 3.3 V, 300 mA out, SOT-223-3

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PCB Footprints
MCP1755ST-3302E/DB - Microchip PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - 3-Lead Plastic Small Outline Transistor (DB) [SOT-223]
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3D Models
MCP1755ST-3302E/DB - Microchip  - 3D model - SOT223 (3-Pin) - 3-Lead Plastic Small Outline Transistor (DB) [SOT-223]
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MCP1755ST-3302E/DB Details

  • Manufacturer Part Number:

    MCP1755ST-3302E/DB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT-223-3

  • Country Of Origin:

    Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    17.6 V

  • Input Voltage-Max:

    16 V

  • Input Voltage-Min:

    3.6 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.02046%

  • Load Regulation-Max:

    0.0165%

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature TJ-Max:

    125 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOT-223

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.8 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.3 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.5 mm

MCP1755ST-3302E/DB Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good airflow around the device. The datasheet provides some guidelines, but a more detailed application note from Microchip provides additional recommendations.
  • To ensure a stable and regulated output voltage, make sure to follow the recommended capacitor values and types, and ensure the input voltage is within the specified range. Additionally, the output voltage can be adjusted using the FB pin, and the device has built-in over-voltage protection.
  • The maximum input voltage that can be applied to the device is 18V, but it's recommended to keep it below 15V for optimal performance and reliability.
  • The device has built-in overcurrent protection, but it's still recommended to add external protection such as fuses or current-limiting resistors to prevent damage from excessive current. Additionally, ensure the output is properly decoupled to prevent oscillations.
  • A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for the input capacitor. This helps to filter out noise and ensure stable operation.

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MCP1755ST-3302E/DB Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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