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MCP1801T-6002I/OT - Microchip

Description: LDO Voltage Regulators Hi PSRR 150 mA LDO Vin 10V maxVout 6.0V

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PCB Footprints
MCP1801T-6002I/OT - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - (OT) [SOT-23]
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3D Models
MCP1801T-6002I/OT - Microchip  - 3D model - SOT23 (5-Pin) - (OT) [SOT-23]
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MCP1801T-6002I/OT Details

  • Manufacturer Part Number:

    MCP1801T-6002I/OT

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Package Description:

    PLASTIC, SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    10

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.25 V

  • Dropout Voltage1-Nom:

    0.2 V

  • Input Voltage Absolute-Max:

    12 V

  • Input Voltage-Max:

    10 V

  • Input Voltage-Min:

    7 V

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Line Regulation-Max:

    0.036%

  • Load Regulation-Max:

    0.05%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    6.12 V

  • Output Voltage1-Min:

    5.88 V

  • Output Voltage1-Nom:

    6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    TS 16949

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2%

  • Width:

    1.55 mm

MCP1801T-6002I/OT Frequently Asked Questions (FAQs)

  • Microchip recommends a 4-layer PCB with a solid ground plane, and to keep the input and output traces separate to minimize noise. Additionally, it's recommended to use a ferrite bead or a 10uF capacitor in series with the input voltage to filter out high-frequency noise.
  • To ensure stability, make sure to follow the recommended output capacitor values and ESR (Equivalent Series Resistance) in the datasheet. Additionally, ensure that the input voltage is well-regulated and free of noise, and that the output is not overloaded.
  • The maximum output current of the MCP1801T-6002I/OT is 1A, but it's recommended to derate the output current based on the ambient temperature and the input voltage to ensure reliable operation.
  • The MCP1801T-6002I/OT is rated for operation up to 125°C, but the output current and voltage regulation may degrade at high temperatures. It's recommended to derate the output current and voltage based on the ambient temperature to ensure reliable operation.
  • To troubleshoot issues with the MCP1801T-6002I/OT, check the input voltage, output current, and output voltage using an oscilloscope or a multimeter. Ensure that the input voltage is within the recommended range, and that the output is not overloaded. Also, check the PCB layout and ensure that it follows the recommended layout guidelines.

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MCP1801T-6002I/OT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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