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MCP1812BT-033/OT - Microchip

Description: LDO Voltage Regulators Ultra Low Iq LDO

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PCB Footprints
MCP1812BT-033/OT - Microchip PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - 5-Lead Plastic Small Outline Transistor (OT) [SOT23]
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3D Models
MCP1812BT-033/OT - Microchip  - 3D model - SOT23 (5-Pin) - 5-Lead Plastic Small Outline Transistor (OT) [SOT23]
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MCP1812BT-033/OT Details

  • Manufacturer Part Number:

    MCP1812BT-033/OT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 5 PIN

  • Pin Count:

    5

  • Manufacturer Package Code:

    SOT-23-5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.6 V

  • Dropout Voltage1-Nom:

    0.4 V

  • Input Voltage Absolute-Max:

    6 V

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    3.9 V

  • JESD-30 Code:

    R-PDSO-G5

  • Length:

    2.9 mm

  • Load Regulation-Max:

    0.05%

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    85 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.3 A

  • Output Voltage1-Max:

    3.432 V

  • Output Voltage1-Min:

    3.168 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Seated Height-Max:

    1.45 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Voltage Tolerance-Max:

    4%

  • Width:

    1.6 mm

MCP1812BT-033/OT Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 2-layer or 4-layer PCB with a solid ground plane is recommended. Avoid placing thermal vias under the device, and keep the thermal pad clear of any obstacles.
  • To ensure reliable startup and shutdown, ensure that the input voltage rises and falls monotonically, and that the input voltage is within the recommended operating range. Also, ensure that the output capacitor is properly sized and placed close to the device to minimize inductance and ensure stable operation.
  • Handle the device by the body or the pins, avoiding touching the die or the bond wires. Use an anti-static wrist strap or mat to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the leads, and use a soldering iron with a temperature-controlled tip to prevent overheating.
  • To troubleshoot issues, start by verifying the input voltage and current, and checking the output voltage and current. Check for proper PCB layout and thermal design. Use an oscilloscope to check for oscillations or noise on the output. Check the device's thermal performance and ensure proper heat sinking. Consult the datasheet and application notes for guidance.
  • To ensure EMI and EMC compliance, use a shielded enclosure, and ensure proper PCB layout and routing to minimize radiated emissions. Use a common-mode choke or ferrite bead to filter the input and output lines. Ensure that the device is properly decoupled and that the output capacitor is properly sized and placed.

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MCP1812BT-033/OT Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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