MCP23S09-E/MG - Microchip

MCP23S09-E/MG Details

• Manufacturer Part Number:

  MCP23S09-E/MG

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Part Package Code:

  QFN

• Package Description:

  QFN-16

• Pin Count:

  16

• Manufacturer Package Code:

  QFN-16

• Country Of Origin:

  Thailand

• ECCN Code:

  EAR99

• HTS Code:

  8542.39.00.01

• Factory Lead Time:

  2 Weeks

• Manufacturer:

  Microchip Technology Inc

• YTEOL:

  9

• Clock Frequency-Max:

  10 MHz

• JESD-30 Code:

  S-XQCC-N16

• JESD-609 Code:

  e3

• Length:

  3 mm

• Moisture Sensitivity Level:

  1

• Number of Bits:

  8

• Number of I/O Lines:

  8

• Number of Ports:

  1

• Number of Terminals:

  16

• Operating Temperature-Max:

  125 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  UNSPECIFIED

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC16,.12SQ,20

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  0.9 mm

• Supply Current-Max:

  1 mA

• Supply Voltage-Max:

  5.5 V

• Supply Voltage-Min:

  1.8 V

• Supply Voltage-Nom:

  5 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  AUTOMOTIVE

• Terminal Finish:

  Matte Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  3 mm

• uPs/uCs/Peripheral ICs Type:

  PARALLEL IO PORT, GENERAL PURPOSE