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MCP3919A1-E/SS - Microchip

Description: Analog Front End - AFE 3 Chnl Energy Meter Front End 3V SPI/2

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MCP3919A1-E/SS - Microchip PCB footprint - Small Outline Packages - Small Outline Packages - 28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP]
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MCP3919A1-E/SS - Microchip  - 3D model - Small Outline Packages - 28-Lead Plastic Shrink Small Outline (SS) - 5.30 mm Body [SSOP]
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MCP3919A1-E/SS Details

  • Manufacturer Part Number:

    MCP3919A1-E/SS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    5.30 MM WIDTH, LEAD FREE, PLASTIC, SSOP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SSOP-28

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    Microchip Technology Inc

  • YTEOL:

    14

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    2

  • Number of Channels:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Equivalence Code:

    SSOP28,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    5.3 mm

MCP3919A1-E/SS Frequently Asked Questions (FAQs)

  • It is recommended to separate the analog and digital sections of the PCB with a ground plane in between. The analog section should be placed near the ADC inputs, and the digital section should be placed near the microcontroller. Use short, direct traces for the analog signals, and avoid crossing digital signals over the analog section.
  • To optimize the performance of the ADC, ensure that the input signals are within the recommended range, and that the analog supply voltage is clean and stable. Also, consider using a low-pass filter to remove high-frequency noise from the input signals, and use the ADC's built-in features such as gain and offset calibration to improve accuracy.
  • The recommended clock frequency for the ADC is between 1-4 MHz. The clock frequency affects the conversion rate, with higher clock frequencies resulting in faster conversion rates. However, higher clock frequencies also increase the power consumption and noise sensitivity of the ADC.
  • The ADC has built-in error detection and correction mechanisms, such as overflow and underflow flags. The microcontroller can monitor these flags and take corrective action, such as resetting the ADC or re-configuring the gain settings. Additionally, the ADC has a built-in CRC error detection mechanism to ensure data integrity.
  • Yes, the ADC can be used in a multi-channel configuration. The channel selection is configured through the ADC's control registers, which allow the user to select the input channel, gain, and offset settings for each channel. The ADC also has a built-in channel sequencer that allows for automatic channel switching.

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MCP3919A1-E/SS Overview

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About Microchip

Microchip Technology Inc. is a leading manufacturer of microcontrollers and semiconductor devices for a wide range of applications in the aerospace, automotive, consumer electronics, industrial, and medical industries. Alongside a comprehensive product portfolio, Microchip Technology Inc. also provides easy-to-use development tools that enable engineers to create optimal designs quickly with minimal iterations to reduce risk while lowering total system costs to market. Headquartered in Chandler, Arizona, th

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